Power chips are connected to outside circuits through product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power chips are typically packaged as power modules. Chip interconnection describes the electric link on the upper surface of the chip, which is generally light weight aluminum bonding cable in conventional components. ^
Standard power module plan cross-section
At present, commercial silicon carbide power modules still primarily use the product packaging innovation of this wire-bonded conventional silicon IGBT module. They encounter issues such as huge high-frequency parasitic parameters, not enough warm dissipation capability, low-temperature resistance, and inadequate insulation stamina, which restrict making use of silicon carbide semiconductors. The display of excellent efficiency. In order to resolve these problems and totally exploit the huge potential advantages of silicon carbide chips, numerous brand-new packaging technologies and services for silicon carbide power modules have actually emerged in the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold wire bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold wires to copper wires, and the driving force is cost reduction; high-power gadgets have actually developed from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to improve product performance. The higher the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared with standard bonding product packaging methods, Cu Clip modern technology has the following advantages:
1. The connection between the chip and the pins is made of copper sheets, which, to a certain extent, changes the standard cable bonding technique in between the chip and the pins. Therefore, an unique package resistance worth, greater existing circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can totally conserve the price of silver plating and poor silver plating.
3. The product appearance is completely constant with regular items and is mostly used in servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has two bonding approaches.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding technique is more costly and complex, yet it can attain much better Rdson and better thermal impacts.
( copper strip)
Copper sheet plus wire bonding approach
The resource pad utilizes a Clip technique, and the Gate utilizes a Wire approach. This bonding technique is somewhat more affordable than the all-copper bonding technique, saving wafer area (applicable to very little gateway locations). The procedure is simpler than the all-copper bonding method and can get much better Rdson and far better thermal result.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding scrap copper price per pound, please feel free to contact us and send an inquiry.
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